Hardware Section
- Basics of Mobile Communication, Tools & Instruments
- Use of Multi meter, Use of Battery Booster
- Basic Circuit Board Introduction, Assembling & Disassembling Mobile Phone Reconditioning, Identification of Different IC’s
- Work of Different IC’s. Fault Diagnosing & Troubleshooting
- Jumpering Techniques, Water / Liquid Damage Repairs, Keypad, Battery / Charging, On / Off Button, Signal Reception, LCD, LED, Bluetooth / WiFi, Power, Microphone / Mouthpiece, Speaker / Ear Piece & Solutions.
Practice Section
- Practice of Soldering Iron, Practice of S.M.D Rework Station
- Soldering & Disordering Components, Practice of Regulated Power Supply
- Usage of Mobile P.C.B Holder, Usage of BGA Plate
- Usage of BGA Paste / S.M.D Paste, Usage of Circuit Checking Device
- Working on S.M.D / BGA ICs and the P.C.B, Color Light Installation
- Sim Jack, LCD Jack & Charging Jack Sold & Unsold
- All Types of IC’s Replacement, IC Alteration & Jumping Techniques
Course Objective
To make a student that can able to assembly-disassemble, Service & checking components of mobile Phones PCB (printed circuit broad) with using proper tools. On completion of this course, he/she will be able to diagnose & repair any kind of mobile phones software & hardware faults and can easily Read mobile phone block & layout Diagrams diagnose problems and repair it by using proper tips and techniques.
Career Option
On the successful completion of this course the student can join as a customer support executive in any existing mobile service center & repairing Center. Or establish his/her own business of mobile phones.
